A demonstration of the transmitter and receiver system prototyped by Sony. It wirelessly transmitted high-speed signals at a distance of several tens of millimeters.
A demonstration of the transmitter and receiver system prototyped by Sony. It wirelessly transmitted high-speed signals at a distance of several tens of millimeters.
[Click to enlarge image]
The transmitting circuit module (left) and the receiving circuit module (right). This prototype is only for demonstration purpose and has an antenna formed by using printing technology.
The transmitting circuit module (left) and the receiving circuit module (right). This prototype is only for demonstration purpose and has an antenna formed by using printing technology.
[Click to enlarge image]
The millimeter wave module developed by Sony
The millimeter wave module developed by Sony
[Click to enlarge image]

Sony Corp developed an elemental technology for interconnecting semiconductor chips mounted on a circuit board inside an electronic devices such as a TV by using wireless transmission instead of electric wiring.

In place of signal wiring, which is normally used for interconnecting chips, radio waves in the 60GHz millimeter waveband are utilized for wireless data transmission. As a result, chips can be more freely laid out on a circuit board, and they can be arranged three-dimensionally. Furthermore, it eliminates the need for terminals for signal input and output, enabling to reduce the size of the chip, the company said.

This time, Sony prototyped millimeter wave transmitting and receiving circuits by using CMOS technology.

Technology to lower costs

Sony calls the new technology "high-speed wireless transmission technology for the inside of a device." Normally, millimeter wave transmission technologies are used to transfer data between devices such as a mobile phone and a digital home appliance. And it is very rare to apply those technologies to interconnect parts in a device. Sony came up with the idea to realize high speed signal transmission inside an electronic device, it said.

"We are facing some problems related to signal wiring inside a device as the data transmission speed is increasing," Sony said. "First, the number of substrate layers is increasing as the number of wires has increased. Second, the number of the terminals of a semiconductor package is now several hundreds to more than a thousand, increasing the chip area."

"Those are all cost factors," it continued. "We will solve those problems by eliminating signal wiring with the wireless transmission technology. So, we define it as a technology to lower costs."

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