SanDisk's New X4 Technology Features 4-bits-per-cell Architecture to Make the "World's Largest Capacity" Flash Memory Chip
SanDisk's New X4 Technology Features 4-bits-per-cell Architecture to Make the "World's Largest Capacity" Flash Memory Chip
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SanDisk Corp announced that it will begin mass-production of what it claims is the world's first high performance 4-bits-per-cell (X4) Flash memory, building on its leadership in multi-level cell (MLC) technology. The 64Gb X4 Flash memory chip on 43nm technology is co-developed with Toshiba Corp, which cooperates in the development and manufacturing of advanced Flash memory.

Using 43nm process technology, this breakthrough enables 64Gb memory in a single die – said to be the highest capacity in the industry and suitable for the most demanding storage applications.

Sandisk said it has also produced an advanced X4 controller, which is necessary to effectively manage the complexities and performance requirements of X4 memory. The X4 memory chip combines with the X4 controller chip in a multi-chip package (MCP) to provide a complete, integrated and low-cost storage solution.

The 43nm 64Gb X4 chip is said to offer the highest capacity and highest density Flash memory die in the world to enter production this year, boasting a 7.8MB/sec memory write performance that is comparable with current MLC technologies. SanDisk's All-Bit-Line (ABL) architecture as well as the three-step programming (TSP) and sequential sense concept (SSC) serve as key enablers to X4's impressive performance.

The X4 controller utilizes a first-of-its-kind error correcting code (ECC) scheme specifically developed for use in storage systems, and tailored to support the 16 levels of distribution needed for 4-bits-per-cell.