Continued from [iPhone X Teardown] 2 Batteries Inside

Nikkei Technology Online Teardown Squad successfully took out batteries from the iPhone X and started to examine the main board.

Before the release of the iPhone X, many experts expected that the main board would be one of the "highlights" of the phone because of the following reason. The previous iPhones have a structure that vertically splits the internal space into two and gives each space to the battery and the main board. This time, however, it was reported that the battery capacity would increase. When the battery increases, the space for the main board decreases. Engineers were very interested in what kinds of measures Apple would take to further increase the density of the board.

The main board being detached from a PCB from which the batteries were removed

In fact, as we reported in the previous story, Apple used two batteries and arranged them in an L shape, increasing the ratio of the space occupied by battery. As a result, the space for the main board decreased by about 1/3.

To reduce the area of the main board, Apple seems to have employed a technology called "MSAP." It is a king of "SAP (semi additive process," which forms micro circuits on printed circuit boards by plating. It is a technology that enables to form micro circuits relatively easily. It is usually used for package boards, and the iPhone X is the first consumer device that has employed the MSAP for a main board. This time, with the MSAP employed for the iPhone X, the line width and interval were expected to be both 30μm.

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