Samsung Electronics Co Ltd announced a 2-Tbyte SSD with a module size as small as 80 x 22mm Sept 21, 2016.
The SSD, "960 PRO," is the world's first SSD that has a capacity of 2 Tbytes with the M.2 form factor, the company said, claiming that it is leading the densification of SSDs in the industry.
What kinds of elemental technologies did Samsung use to realize the ultra-small SSD? At Samsung SSD Global Summit 2016, which the company had to announce its SSD technologies in Seoul, South Korea, Sept 21, 2016, it disclosed three key technologies.
First, Samsung used the "V-NAND" 3D flash memory technology to realize a capacity of 32 Gbytes (256 Gbits) per chip. It is the third-generation V-NAND using the MLC (multi-level cell) technology. It seems that 48 layers of memory cells are vertically stacked per chip.
Second, Samsung applied a high-density mounting technology for stacking 16 32-Gbyte V-NAND chips in a package. Though the company did not disclose the details of the technology, judging from a picture shown in the presentation, it seemed that 16 chips are stacked by using a wire-bonding technology.
With this technology, Samsung realized a storage capacity of 512 Gbytes per package. By horizontally arranging four packages in a module, a storage capacity of 2 Tbytes was realized.
Third, Samsung used a PoP (package on package) technology for stacking the package of a memory controller chip and a DRAM package. This is also a high-density mounting technology.
"If the memory controller and DRAM had been horizontally arranged like conventional methods, it would have been difficult to realize the 2-Tbyte storage capacity with the M.2 form factor because of a shortage of space," Samsung said. "Therefore, we decided to use the PoP technology to stack the DRAM package on the package of the controller."