Tamura Corp announced that its "SAM32" conductive jointing material was employed for Kyocera Corp's "Digno R SoftBank 202K," the world's lightest waterproof smartphone announced in May 2013.
The material contributed to the light weight. Specifically, it enabled to join a flexible printed circuit board (PCB) to a PCB and join two flexible PCBs together without using a connector, reducing board space by 20%.
The conductive jointing material is a thermosetting resin containing solder particles. It can be applied by using a dispenser and thermocompression bonding. Moreover, it maintains electric insulation between adjacent electrodes and ensures electric conductivity between counter electrodes of PCBs.
Furthermore, because it can be applied by using a dispenser, a mounting position can be decided more freely. And it reduces dead space because it enables jointing with a low pressure.
With the SAM32, jointing becomes possible in six seconds at a temperature of 150°C and with a low pressure of 1MPa. It supports Au (gold) and Cu-OSP treatments and rework at a temperature of 150°C.
Tamura's conductive jointing materials are products developed by using junction technologies licenced from Panasonic Factory Solutions Co Ltd.