Continued from [3DS LL Teardown (2)] Taking Out Main Board
In the aim of examining the main CPU, which was expected to be located under the slot for game software, we tried to remove the slot. However, it was firmly fixed to the main board with solder and could not be easily detached. In addition to the part having pins for transmitting data of game software, four areas were soldered to fix the slot.
We used a soldering iron to melt the solder but found it difficult. So, we filed the solder to make it thin and tried to melt it with the soldering iron again. Still, it took time to melt the solder. So, after melting the solder in two of the four areas, we peeled off the slot by sheer force.
As we expected, there was the main CPU under the slot. And we found an FCRAM chip that seemed to be manufactured by Fujitsu Semiconductor Ltd. The 3DS has the same structure.
The sizes of the main CPU and the FCRAM were 16 x 16mm and 11 x 11mm, respectively, which are the same as the sizes of the 3DS' main CPU and FCRAM. The surface of the main CPU was printed with the Nintendo's logo, "1214 32," "CPU CTR," "ARM," etc. Among them, the main CPU of the 3DS was not printed with "1214 32." Instead, it was printed with "1037 21."
The surface of the FCRAM was printed with "MB82DBS16641," which is different from the characters printed on the 3DS' FCRAM.
We finished the teardown of the lower case and started to break down the upper case.