NTT Docomo Inc, NEC Corp, Panasonic Mobile Communications Co Ltd and Fujitsu Ltd jointly developed the "LTE-PF," a communication platform compatible with the next-generation mobile communications standard "LTE (long term evolution)," for mobile terminals.

The LTE-PF consists of a chipset for baseband processing and communication control software. This time, the companies announced that they prototyped the baseband processing chipset and are currently evaluating the performance of the main functions.

Aimed at mobile phones and data communication cards, the LTE-PF supports the LTE standard of the 3GPP (3rd Generation Partnership Project) and features data transmission speeds of up to 100Mbps for data reception and up to 50Mbps for data transmission. Also, it has a function to smoothly switch between LTE and W-CDMA or GSM when entering and exiting an LTE coverage area by utilizing communication platforms for W-CDMA and GSM.

The companies did not disclose which company will manufacture the baseband processing chipset. But they are considering licensing the LTE-PF to handset makers and communications chipset manufacturers in and outside Japan.

They plan to have an exhibit on the LTE-PF at CEATEC JAPAN 2009, which will run from Oct 6 to 10, 2009, at Makuhari Messe in Chiba Prefecture, Japan, and at ITU Telecom World 2009, which will take place from Oct 5 to 9, 2009, in Geneva, Switzerland.