Fujitsu Microelectronics Ltd developed a Mobile WiMAX module that can be used to downsize "USB dongle-type" communication devices.
The module is exhibited at Interop Tokyo 2009, which is taking place at Makuhari Messe in Chiba Prefecture, Japan.
It includes Fujitsu Microelectronics' baseband processing LSI chip and RF circuit module. With this module, it is possible to realize USB dongles smaller than existing ones. The release date has not been determined yet.
The new module uses the "MB86K23" baseband processing LSI chip and the "MB86K73" RF circuit module, both of which were developed by Fujitsu Electronics. The MB86K23 supports USB connection and is appropriate for use in USB-connected devices, according to the company.
In addition, Fujitsu Microelectronics exhibited a more compact Mobile WiMAX module intended for use in mobile phones in its booth.