Fujitsu Ltd, NTT DoCoMo Inc, Renesas Technology Inc and Sharp Corp will jointly develop the "SH-Mobile G4," a SoC for use in mobile phones, and a mobile phone platform based on the chip.
They aim to complete the development during the fourth quarter of fiscal 2009 ending March 2010.
The four companies will manufacture the SH-Mobile G4, which will support HD (high definition) video processing and faster 3D graphics processing, using 45nm process technology, they said.
In addition to HSDPA (high speed downlink packet access) cat.8, which increases download speeds (up to 7.2Mbps), HSUPA (high speed uplink packet access) will be introduced in an effort to enable full-duplex data communications at higher speeds by accelerating the upload speed from the current 384kbps to 5.7Mbps.
Renesas is planning to provide the SH-Mobile G4 in not only the Japanese market but also in other mobile phone markets around the world. The SoC and the platform will support W-CDMA and GSM/GPRS/EDGE (2G) along with HSUPA and HSDPA.