Kyocera Corp. has developed "FWMG0-03," a wireless LAN module measuring 10 x 8 mm with a maximum thickness of 1.25 mm for use in compact mobile devices. Targeting mobile phones and other mobile devices, the company plans to start volume production as early as within 2006.
The module supports IEEE802.11g and IEEE802.11b transmission modes. The low temperature cofired ceramic (LTCC) used in the module board has been improved, resulting in an enhanced bending strength of 400 MPa which is approximately double that of the general LTCC. Thus, the thickness of the board is reduced to as thin as 0.55 mm. Another factor that contributes to the reduction in module thickness is that a wireless LAN chipset and other components are mounted on a single side of the board.
The standby power consumption is 0.85 mW. The module consumes 550 mW when transmitting data in both transmission modes. At data reception, the power consumptions in 11b and 11g modes are 291 mW and 345 mW, respectively. Three models are available with an operating voltage of 1.2, 1.8 or 3.3 V. The supported interfaces are SDIO and SPI.
Developing compact wireless LAN modules smaller than 10 x 10 mm has been booming since the beginning of 2006. It is because the wireless LAN will expectedly be further supported by a wider range of mobile devices including not only mobile phones but also portable music players, portable game consoles and digital cameras beyond 2007. Thus far, Murata Manufacturing Co., Ltd. has launched volume production of wireless LAN modules smaller than 10 x 10 mm while Alps Electric Co., Ltd., Fujitsu Media Devices Ltd., and other firms are planning mass production within 2006.